SOUND DETECTION MECHANISM

Title:

SOUND DETECTION MECHANISM

Document Type and Number:

WIPO Patent Application WO/2005/009077

Kind Code:

A1

Abstract:

A sound detection mechanism allowing a diaphragm and rear electrodes to be formed on a substrate by a simple process. An acoustic hole forming through holes (Ba) is formed on the front surface side of the substrate (A), a second protective film (406), a sacrifice layer D (407), and a metal film (408) are laminated on the front surface side at the position of the acoustic hole, and etching is performed from the rear surface side of the substrate (A) to the depth of the acoustic hole to form an acoustic opening (E). Then, etching is performed from the rear surface side of the substrate (A) through the acoustic hole to remove the sacrifice layer (407) so as to form a space area (F) between the diaphragm (C) formed of the metal film (408) and the substrate (A) and to form the through holes (Ba), and the sacrifice layer (407) left after the etching is used as a spacer (D) keeping a distance between the back electrode (B) and the diaphragm (C).

Inventors:

OHBAYASHI YOSHIAKI (JP)
YASUDA MAMORU (JP)
SAEKI SHINICHI (JP)
KOMAI MASATSUGU (JP)
KAGAWA KENICHI (JP)

Application Number:

PCT/JP2004/010042

Publication Date:

January 27, 2005

Filing Date:

July 14, 2004

Export Citation:

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Assignee:

HOSIDEN CORP (JP)
TOKYO ELECTRON LTD (JP)
OHBAYASHI YOSHIAKI (JP)
YASUDA MAMORU (JP)
SAEKI SHINICHI (JP)
KOMAI MASATSUGU (JP)
KAGAWA KENICHI (JP)

International Classes:

H04R19/04; H04R19/00; H04R31/00; (IPC1-7): H04R19/04

Foreign References:

JP2003163996A	2003-06-06
JPH0895572A	1996-04-12
JP2002209298A	2002-07-26
JP2002223499A	2002-08-09
JP2003163998A	2003-06-06

Other References: