Title:
SOUND PICK-UP STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2023/067951
Kind Code:
A1
Abstract:
This sound pick-up structure is composed of a microphone unit 10 attached to a ceiling material 3 in which a surface skin 3b is stacked on one surface of a base material 3a. The base material 3a has a core layer and a fiber-reinforced layer stacked on at least one surface of the core layer. The surface skin 3b is stacked, on the one surface side of the base material 3a, on a surface of the fiber-reinforced layer opposite to the core layer. The microphone unit 10 is attached to a surface of the base material 3a opposite to the surface skin 3b. The base material 3a has, in a region opposed to the microphone unit 10, hole parts 6 that open on the microphone unit 10 side and that have such a depth as to penetrate through the core layer or to leave a portion of the core layer therein.
Inventors:
TSUTSUI KATSUNORI (JP)
SUGIE TAKESHI (JP)
SUGIE TAKESHI (JP)
Application Number:
PCT/JP2022/034235
Publication Date:
April 27, 2023
Filing Date:
September 13, 2022
Export Citation:
Assignee:
HAYASHI TELEMPU CORP (JP)
International Classes:
H04R1/02; B60R11/02; B60R13/02
Domestic Patent References:
| WO2020126144A1 | 2020-06-25 |
Foreign References:
| JP2009279964A | 2009-12-03 | |||
| US20130208913A1 | 2013-08-15 |
Attorney, Agent or Firm:
MIYAZAKI Teruo et al. (JP)
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