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Patent Searching and Data


Title:
SOUND PRODUCING MODULE
Document Type and Number:
WIPO Patent Application WO/2019/015161
Kind Code:
A1
Abstract:
The present application relates to a sound producing module. The sound producing module comprises a module casing, sound absorbing material particles and a packaging piece. The module casing has a rear sound cavity therein and a thinned wall. The thinned wall is used for enclosing and forming the rear sound cavity and provided with a filling hole thereon to have the rear sound cavity being in communication with the outside. The sound absorbing material particles are filled in the rear sound cavity inside the filling hole. The module casing is formed with a pad at a position inside the thinned wall surrounding the filling hole. The packaging piece is disposed on the filling hole to seal the filling hole. The present application addresses the technical problem of hindered sealing due to the adherence of sound absorbing material particles to a packaging piece.

Inventors:
ZHANG BEIJING (CN)
JIA FENGCHAO (CN)
TANG LANXIN (CN)
LIU GANG (CN)
Application Number:
PCT/CN2017/108380
Publication Date:
January 24, 2019
Filing Date:
October 30, 2017
Export Citation:
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Assignee:
GOERTEK INC (CN)
International Classes:
H04R9/02; H04R9/06
Domestic Patent References:
WO2016059119A12016-04-21
Foreign References:
CN207070304U2018-03-02
CN106851498A2017-06-13
CN105657615A2016-06-08
CN105872915A2016-08-17
CN105916081A2016-08-31
Attorney, Agent or Firm:
BEYOND TALENT PATENT AGENT FIRM (CN)
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