Title:
SOUND-PROOFING STRUCTURE, SOUND-PROOFING ENCLOSURE, AND SOUND-PROOFING BOX
Document Type and Number:
WIPO Patent Application WO/2019/138884
Kind Code:
A1
Abstract:
This sound-proofing structure has: a honeycomb core; a first surface plate and a second surface plate which sandwich the honeycomb core; through-holes perforated in the first surface plate; and a sound absorbing body arranged on one surface of the first surface plate, the one side being located on the honeycomb core side, wherein the opening ratio of the through-holes in the first surface plate is at least 1.0%. This sound-proofing enclosure and sound-proofing box use the sound-proofing structure. This sound-proofing structure can achieve a sturdy and lightweight sound-proofing box capable of broadband sound absorption and having improved sound absorbing performance.
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Inventors:
YAMAZOE SHOGO (JP)
HAKUTA SHINYA (JP)
MATSUOKA CHIKA (JP)
HAKUTA SHINYA (JP)
MATSUOKA CHIKA (JP)
Application Number:
PCT/JP2018/047879
Publication Date:
July 18, 2019
Filing Date:
December 26, 2018
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
G10K11/16; B32B3/12; E04B1/86; G10K11/162; G10K11/172
Domestic Patent References:
| WO2017170353A1 | 2017-10-05 |
Foreign References:
| JP2016200695A | 2016-12-01 | |||
| JPS6314300U | 1988-01-29 | |||
| JP2012013912A | 2012-01-19 | |||
| JP2017151256A | 2017-08-31 | |||
| JP3100699U | 2004-05-27 | |||
| JP2010191029A | 2010-09-02 | |||
| JP2012103556A | 2012-05-31 |
Attorney, Agent or Firm:
ITOH Hideaki et al. (JP)
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