Title:
SOUNDPROOF HOUSING FOR EARSET AND WIRED AND WIRELESS EARSET COMPRISING SAME
Document Type and Number:
WIPO Patent Application WO/2013/147385
Kind Code:
A1
Abstract:
The present invention relates to a soundproof housing for an earset, and an earset comprising same. The present invention provides a soundproof housing for an earset, comprising: a housing main body, which is coupled to the inside of a front surface case having a protrusion portion that is inserted into the ear, and which is provided with a speaker accommodation groove for accommodating a speaker and a microphone accommodation groove for accommodating a microphone; a speaker output hole, which is penetratingly formed in the speaker accommodation groove so as to communicate with the front surface case, and adjacent to which the output end of the speaker is arranged; and a microphone input hole, which is formed in a recessed manner inside the microphone accommodation groove so as to communicate with the front surface case, and which is arranged adjacent to the input end of the microphone, wherein the housing main body is protrudingly formed as a long protrusion toward the inside of the protrusion portion of the front surface case, so as to be tightly coupled with the inside of the protrusion portion of the front surface case.
Inventors:
SHIN DOO SIK (KR)
Application Number:
PCT/KR2012/009490
Publication Date:
October 03, 2013
Filing Date:
November 09, 2012
Export Citation:
Assignee:
SHIN DOO SIK (KR)
International Classes:
H04R1/10
Foreign References:
| KR20060129062A | 2006-12-14 | |||
| KR101082372B1 | 2011-11-11 | |||
| KR101023467B1 | 2011-03-25 | |||
| KR200296816Y1 | 2002-12-05 | |||
| JP2009516409A | 2009-04-16 |
Other References:
See also references of EP 2833644A4
None
None
Attorney, Agent or Firm:
LEE, HYOUNG GYU (KR)
이형규 (KR)
이형규 (KR)
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