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Title:
SOUNDPROOF MATERIAL
Document Type and Number:
WIPO Patent Application WO/2014/006896
Kind Code:
A1
Abstract:
In order to improve the performance of a soundproof material in which chips (12) are used, this soundproof material is provided with a chip material layer (21) which comprises many chips (12), said chip material layer (21) being covered with a film and provided with an air-impermeable intermediate film layer (27) that divides the chip material layer (21) into multiple layers.

Inventors:
ARATA MITSUAKI (JP)
KANEDA HIROAKI (JP)
EMORI SHINICHIRO (JP)
KAMEOKA TAISUKE (JP)
KOHARA YOSHIHIRO (JP)
IKUMA YOSHIHIRO (JP)
Application Number:
PCT/JP2013/004134
Publication Date:
January 09, 2014
Filing Date:
July 03, 2013
Export Citation:
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Assignee:
NISHIKAWA RUBBER CO LTD (JP)
International Classes:
G10K11/16; B32B5/18; B32B7/02; B60R13/08; G10K11/162
Foreign References:
JPH10299115A1998-11-10
JPS6334138A1988-02-13
JPS61111338A1986-05-29
JPH112385A1999-01-06
JP2010006312A2010-01-14
JP3675359B22005-07-27
JP2011240821A2011-12-01
JP2005316353A2005-11-10
JP2003150169A2003-05-23
JP2002264736A2002-09-18
Other References:
See also references of EP 2871637A4
Attorney, Agent or Firm:
MAEDA & PARTNERS (JP)
Patent business corporation MAEDA PATENT OFFICE (JP)
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