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Patent Searching and Data


Title:
SPACER, LAMINATE OF SUBSTRATES, SUBSTRATE PRODUCTION METHOD, AND METHOD FOR PRODUCING SUBSTRATE FOR MAGNETIC DISK
Document Type and Number:
WIPO Patent Application WO/2019/172456
Kind Code:
A1
Abstract:
In the present invention, a spacer is interposed between each pair of adjacent substrates from among substrates forming a laminate so as to separate the adjacent substrates from each other, and the spacer has a smaller area than the laminated substrates. When the state of the laminate having such spacers interposed between the substrates has been changed from a pressed state, in which a pressure of 0.60 MPa is applied thereto in the laminating direction, to a non-pressed state, in which the pressure is released, the amount of change ∆W in thickness per one spacer, calculated from the thickness of the laminate having changed due to the release of the pressure, is 30 μm or smaller.

Inventors:
TAKANO, Masao (6-10-1 Nishi-Shinjuku Shinjuku-k, Tokyo 47, 〒1608347, JP)
Application Number:
JP2019/009826
Publication Date:
September 12, 2019
Filing Date:
March 11, 2019
Export Citation:
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Assignee:
HOYA CORPORATION (6-10-1 Nishi-Shinjuku, Shinjuku-ku Tokyo, 47, 〒1608347, JP)
International Classes:
G11B5/84; B24B9/00; B24B41/06; B32B7/022; B32B17/10; B32B37/18
Attorney, Agent or Firm:
GLOBAL IP TOKYO (CARMEL II, 8-3-30 Nishi-Shinjuku, Shinjuku-k, Tokyo 23, 〒1600023, JP)
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