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Title:
SPD WITH DISCONNECTION FUNCTION AND MANUFACTURING METHOD THEREOF
Document Type and Number:
WIPO Patent Application WO/2008/010410
Kind Code:
A1
Abstract:
This invention provides a highly reliable SPD with a disconnection function which can realize reliable thermal fuse operation upon abnormal heat generation due to a deterioration in a zinc oxide varistor. A bent spring part (13c) is formed in a disconnection conductor (13) connected to an electrode (11) of a zinc oxide varistor (1) with the aid of a low melting temperature alloy (14), and the spring part (13c) is housed in a case (30) containing all of the above elements, followed by positioning. In this case, the varistor (1) is rotated in the case (30) to bend the spring part (13c) of the disconnection conductor (13) in a predetermined direction, so that spring forces in two different directions are applied to the spring part (13c) by the displacement due to the bend of the spring part (13c). When the low melting temperature alloy (14) is melted by the abnormal heat generation in the varistor (1), the disconnection conductor (13) is separated from the electrode (11) of the varistor (1) by utilizing the spring forces in two directions of the spring part (13c).

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Inventors:
MISHIMA, Kenshichirou (20-17, Ayukawa 3-chome Ibaraki-sh, Osaka 31, 5670831, JP)
三島 健七郎 (〒31 大阪府茨木市鮎川3丁目20-17 Osaka, 5670831, JP)
IKEDA, Tsuyoshi (7-76, Obayashi 4-chome Takarazukashi Hyogo, 34, 6650034, JP)
池田 剛 (〒34 兵庫県宝塚市小林4丁目7-76 Hyogo, 6650034, JP)
Application Number:
JP2007/063273
Publication Date:
January 24, 2008
Filing Date:
July 03, 2007
Export Citation:
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Assignee:
OTOWA ELECTRIC CO., LTD. (12-13-401, Toyosaki 1-chome Kita-ku, Osaka-sh, Osaka 72, 5310072, JP)
音羽電機工業株式会社 (〒72 大阪府大阪市北区豊崎1丁目12-13-401 Osaka, 5310072, JP)
MISHIMA, Kenshichirou (20-17, Ayukawa 3-chome Ibaraki-sh, Osaka 31, 5670831, JP)
三島 健七郎 (〒31 大阪府茨木市鮎川3丁目20-17 Osaka, 5670831, JP)
IKEDA, Tsuyoshi (7-76, Obayashi 4-chome Takarazukashi Hyogo, 34, 6650034, JP)
International Classes:
H01H37/76; H01C7/12
Attorney, Agent or Firm:
EHARA, Syogo et al. (Ehara Patent Office, 15-26 Edobori 1-chome, Nishi-ku, Osaka-sh, Osaka 02, 5500002, JP)
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