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Patent Searching and Data


Title:
SPEAKER ASSEMBLY AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/148452
Kind Code:
A1
Abstract:
The present application discloses a speaker assembly and an electronic device. The speaker assembly is used in the electronic device. The speaker assembly comprises: a speaker excitation system, comprising a speaker magnetic circuit structure and a speaker vibration structure. Wherein the speaker vibration structure comprises a diaphragm, and the speaker magnetic circuit structure is used to receive an audio signal, and to drive the speaker vibration structure according to the audio signal, and to further drive the diaphragm to generate vibrations; a speaker support, disposed on a side of the speaker magnetic circuit structure away from the speaker vibration structure, and used to fix the speaker excitation system, the speaker support comprising a top surface and a side surface. Wherein the top surface is disposed away from the speaker excitation system, and a through hole corresponding to the position of the diaphragm is provided through the top surface and the side surface, such that sound emitted by vibrations of the diaphragm can be radiated to the periphery of the speaker support through the through hole. By the above means, the present application enables sound generated by vibrations of the diaphragm to radiate to the periphery of the speaker support, thereby increasing space utilization at the periphery of the speaker support.

Inventors:
YANG XIUKANG (CN)
YAO KAI (CN)
Application Number:
PCT/CN2018/075123
Publication Date:
August 08, 2019
Filing Date:
February 02, 2018
Export Citation:
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Assignee:
HYTERA COMM CORP LTD (CN)
International Classes:
H04R9/02
Domestic Patent References:
WO2014021608A12014-02-06
Foreign References:
CN202425024U2012-09-05
CN201674650U2010-12-15
CN205830000U2016-12-21
Attorney, Agent or Firm:
CHINA WISPRO INTELLECTUAL PROPERTY LLP. (CN)
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