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Patent Searching and Data


Title:
SPEAKER MODULE
Document Type and Number:
WIPO Patent Application WO/2018/099074
Kind Code:
A1
Abstract:
Disclosed is a speaker module, comprising a module housing and a speaker unit accommodated within the module housing. A partition extends from the module housing to a module cavity. The speaker unit is mounted in the module cavity via the partition. Also, the speaker unit and the partition divide the module cavity enclosed by the module housing into a front acoustic cavity and a rear acoustic cavity. Provided on the partition is an acoustically sealed pressure relief channel in communication with the front acoustic cavity and with the rear acoustic cavity. The pressure relief channel comprises a through hole provided on the partition. A protruding mesa is provided on the partition at where the through hole is located. A through first stepped hole is provided on the surface of the protruding mesa directly facing the through hole. On the interface between the first stepped hole and the through hole, the section profile of the first stepped hole encloses the section profile of the through hole. A pressure relief groove is provided on the surface of the protruding mesa. The pressure relief groove is extended from the first stepped hole to the edge of the protruding mesa. The present speaker module allows easy temporary sealing of a pressure relief apparatus, facilitates the testing of the hermeticity of the front acoustic cavity, and increases test efficiency.

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Inventors:
HUO XINXIANG (CN)
HAN DAN (CN)
YANG YUN (CN)
Application Number:
PCT/CN2017/091206
Publication Date:
June 07, 2018
Filing Date:
June 30, 2017
Export Citation:
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Assignee:
GOERTEK INC (CN)
International Classes:
H04R9/06
Foreign References:
CN106454663A2017-02-22
CN206272839U2017-06-20
CN204906708U2015-12-23
CN105516870A2016-04-20
CN202759569U2013-02-27
CN204305338U2015-04-29
US20150163572A12015-06-11
US9408009B12016-08-02
Attorney, Agent or Firm:
BEIJING GRANDER IP LAW FIRM (CN)
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