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Patent Searching and Data


Title:
SPEAKER MODULE
Document Type and Number:
WIPO Patent Application WO/2021/000172
Kind Code:
A1
Abstract:
The present application provides a speaker module, including an upper cover plate with a accommodating cavity, a lower cover plate provided opposite to the upper cover plate, and a speaker unit accommodated in the accommodating cavity and fixed to the upper cover plate. The upper cover plate is provided with a bottom wall of the upper cover plate and a sound-absorbing cotton plate fixed on the bottom wall of the upper cover plate in the area where the speaker unit is not placed, the position of the lower cover plate corresponding to the sound-absorbing cotton plate is provided with a bottom wall of the lower cover plate and a baffle that extends from the bottom wall of the lower cover plate toward the upper cover plate and abuts against the sound-absorbing cotton plate, the speaker module also includes a reinforcing rib plate clamped between the baffle and the sound-absorbing cotton plate, the baffle, the reinforcing rib plate, the bottom wall of the upper cover plate, the bottom wall of the lower cover plate and the sound-absorbing cotton plate jointly constitute a filling cavity accommodating sound-absorbing materials, the projections of the baffle and the reinforcing rib plate along the assembly direction of the upper cover plate and the lower cover plate overlap and are located on the sound-absorbing cotton plate, so that the accommodating cavity and the filling cavity are in airflow communication through the air-permeable gap on the sound-absorbing cotton plate.

Inventors:
CHEN ZHICHEN (CN)
SHEN KAIHUA (CN)
Application Number:
PCT/CN2019/094072
Publication Date:
January 07, 2021
Filing Date:
June 30, 2019
Export Citation:
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Assignee:
AAC ACOUSTIC TECH SHENZHEN CO LTD (CN)
AAC TECHNOLOGIES PTE LTD (CN)
International Classes:
H04R9/06
Foreign References:
CN108124225A2018-06-05
CN208908495U2019-05-28
CN206524955U2017-09-26
CN208638569U2019-03-22
US20170359649A12017-12-14
Attorney, Agent or Firm:
HENSEN INTELLECTUAL PROPERTY FIRM (CN)
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