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Patent Searching and Data


Title:
SPECTRAL SENSOR, SPECTRAL SENSOR MODULE, SENSOR APPARATUS AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/221663
Kind Code:
A1
Abstract:
Provided in the present application are a spectral sensor, a spectral sensor module, a sensor apparatus and an electronic device. The spectral sensor comprises a spectral chip and an optical assembly, wherein the spectral chip comprises a light modulation layer and a photoelectric detection layer; the light modulation layer is arranged, in a sensing path of the photoelectric detection layer, on one side of a light incident face of the photoelectric detection layer, and comprises a modulation unit used for modulating incident light; the optical assembly is arranged in a sensing path of the spectral chip; and the optical assembly at least comprises a diaphragm; the incident light passes through the diaphragm to form a light spot which irradiates the light modulation layer, and the light spot covers at least one modulation unit of the light modulation layer; or, the optical assembly comprises a light homogenizing member and a diaphragm, and the incident light passes through the light homogenizing member and the diaphragm to guide an optical signal to the upper surface of the light modulation layer; or, the optical assembly comprises a light homogenizing device and a lens, and the incident light passes through the light homogenizing device and the lens so as to be guided to the surface of the spectral chip at a set incident angle and in a uniform light intensity manner. In addition, the spectral sensor module at least comprises a spectral sensor and a circuit board. The spectral sensor provided in the present application can improve the photoelectric performance, for example, improve the accuracy and stability of spectrum recovery, etc.

Inventors:
HUANG ZHILEI (CN)
XIONG JIAN (CN)
LI QINGQING (CN)
LI LI (CN)
LI XIAOQING (CN)
FENG DONGBAO (CN)
WANG LI (CN)
YAO ZHUANG (CN)
GAI YONGPING (CN)
Application Number:
PCT/CN2023/085130
Publication Date:
November 23, 2023
Filing Date:
March 30, 2023
Export Citation:
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Assignee:
BEIJING SEETRUM TECH CO LTD (CN)
International Classes:
G01J3/28; G01J3/02
Foreign References:
CN113596308A2021-11-02
US20130083312A12013-04-04
CN111490060A2020-08-04
CN111505820A2020-08-07
CN112730267A2021-04-30
CN113588085A2021-11-02
CN210376122U2020-04-21
CN214951801U2021-11-30
CN215953344U2022-03-04
CN217504984U2022-09-27
CN218885141U2023-04-18
US20110063614A12011-03-17
US4448529A1984-05-15
Attorney, Agent or Firm:
FONDEE IP LAW LLC (CN)
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