Title:
SPHERICAL ALUMINA POWDER, RESIN COMPOSITION, AND SEMICONDUCTOR SEALING MATERIAL
Document Type and Number:
WIPO Patent Application WO/2022/071131
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a practical spherical alumina powder that exhibits excellent fluidity. The present invention is a spherical alumina power that has a first maximum peak and a second maximum peak from the small-diameter side in the grain size measured by a laser-diffraction-scattering-type grain size distribution measurement instrument, such that a first maximum particle diameter showing the first maximum peak is within the range of 3-9 μm, a second maximum particle diameter showing the second maximum peak is within the range of 30-50 μm, and the cumulative value of the frequency of each particle diameter in five points obtained by dividing the range from the second maximum particle diameter-10 μm to the second maximum particle diameter+10 μm into four equal parts is 25-45 vol%.
Inventors:
AIKYO TERUHIRO (JP)
NITTA JUNYA (JP)
NITTA JUNYA (JP)
Application Number:
PCT/JP2021/035131
Publication Date:
April 07, 2022
Filing Date:
September 24, 2021
Export Citation:
Assignee:
DENKA COMPANY LTD (JP)
International Classes:
C01F7/021; C08K3/22; C08L101/00; H01L23/29; H01L23/31
Foreign References:
| JP2019044006A | 2019-03-22 | |||
| JP2015093790A | 2015-05-18 | |||
| JP2012020900A | 2012-02-02 | |||
| JP2009274929A | 2009-11-26 | |||
| JP2001226117A | 2001-08-21 | |||
| JPS56834A | 1981-01-07 |
Attorney, Agent or Firm:
TAGUCHI, Masahiro et al. (JP)
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