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Title:
SPHERICAL CRYSTALLINE SILICA POWDER AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2023/022215
Kind Code:
A1
Abstract:
Provided are: spherical crystalline silica powder that is capable of providing a resin molded product which has a high linear thermal expansion coefficient and a low dielectric loss tangent; and a method for producing the same.　In the spherical crystalline silica powder, the number of water molecules that are eliminated at 50-1,000°C when the temperature is raised up to 1,000°C under the condition of 25-30°C/min is 10 μmol/g or less, and 10 mass% or more of the entirety of the powder is α-quartz crystal.　The method for producing spherical crystalline silica powder comprises: (i) heating spherical amorphous silica powder to obtain spherical crystalline silica powder, (ii) bringing the spherical crystalline silica powder into contact with acid, and (iii) heating, at 800-1,400°C, the spherical crystalline silica powder that has been processed in (ii).

Inventors:
KOBAYASHI TAKUJI (JP)
FUKAZAWA MOTOHARU (JP)
OKABE TAKUTO (JP)
Application Number:
PCT/JP2022/031305
Publication Date:
February 23, 2023
Filing Date:
August 19, 2022
Export Citation:
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Assignee:
DENKA COMPANY LTD (JP)
International Classes:
C01B33/18; C01B33/12; C08K3/36; C08L101/00
Domestic Patent References:
WO2020195205A12020-10-01
WO2018186308A12018-10-11
WO2016031823A12016-03-03
Foreign References:
JP2005231973A2005-09-02
JPH0222119A1990-01-25
JPS498638B11974-02-27
JPH04238808A1992-08-26
JP2021178770A2021-11-18
JP2005231973A2005-09-02
JP2021038138A2021-03-11
Other References:
OKABAYASHI MINAHIRO, MIYAZAKI KENJI, KONO TOSHIO, TANAKA MIYOKO, TODA YUMIO : "Preparation of Spherical Particles with Quartz Single Crystal", CHEMISTRY LETTERS, vol. 34, no. 1, 11 December 2004 (2004-12-11), pages 58 - 59, XP093037367, DOI: 10.1246/cl.2005.58
Attorney, Agent or Firm:
SONODA & KOBAYASHI INTELLECTUAL PROPERTY LAW (JP)
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