Title:
SPHERICAL DIAMOND AND MANUFACTURING METHOD FOR SAME
Document Type and Number:
WIPO Patent Application WO/2017/026031
Kind Code:
A1
Abstract:
Among materials that can be obtained on Earth, diamond is a superior general purpose raw material, but diamond lacks workability and a large market could not be developed. Faceting of precious diamonds is known to be commonly performed with good efficiency by self-abrasion, but using molecular dynamics, it became clear that a rate-determining phase at the molecular level for self-abrasion is sp3-sp2 ordered-disordered transition on a crystal surface, that a surface amorphous layer is generated thereby and that the chemical decomposition thereof is the mechanism for facet cuts. Here, a self-abrasion apparatus wherein the action of self-abrasion works with priority not on mechanically strong crystal surfaces within a diamond crystal, but on weak points such as vertices and edges was designed. Spherical diamond is a new and promising diamond raw material that lacks self-aggregating properties, has strong resistance against shocks leading to cleavage and has chemically stable surfaces.
Inventors:
OSAWA EIJI (JP)
YAMANOI RYOUKO (JP)
YAMANOI RYOUKO (JP)
Application Number:
PCT/JP2015/072639
Publication Date:
February 16, 2017
Filing Date:
August 10, 2015
Export Citation:
Assignee:
NANOCARBON RES INST LTD (JP)
International Classes:
C30B29/04
Domestic Patent References:
| WO2015029988A1 | 2015-03-05 |
Foreign References:
| JP2015077657A | 2015-04-23 | |||
| JPH04132606A | 1992-05-06 | |||
| JP2012502812A | 2012-02-02 | |||
| JP2013538274A | 2013-10-10 |
Attorney, Agent or Firm:
KOBAYASHI, Tsunenori (JP)
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