Title:
SPHERICAL SILVER POWDER, METHOD FOR PRODUCING SPHERICAL SILVER POWDER, APPARATUS FOR PRODUCING SPHERICAL SILVER POWDER, AND CONDUCTIVE PASTE
Document Type and Number:
WIPO Patent Application WO/2023/210663
Kind Code:
A1
Abstract:
The present invention provides a spherical silver powder which enables the achievement of excellent fine line printability if used in a conductive paste and the like. The present invention provides a spherical silver powder wherein: the volume-based 10% cumulative diameter D10, the volume-based 50% cumulative diameter D50 and the volume-based 90% cumulative diameter D90 as determined by a laser diffraction method satisfy formula (D90 - D10)/D50 < 1; and the ratio (D50/DBET) of the D50 to the BET diameter DBET is 0.90 to 1.20.
Inventors:
OSAKO MASAYA (JP)
NAKANOYA TARO (JP)
TAKAHASHI TETSU (JP)
NAKANOYA TARO (JP)
TAKAHASHI TETSU (JP)
Application Number:
PCT/JP2023/016355
Publication Date:
November 02, 2023
Filing Date:
April 25, 2023
Export Citation:
Assignee:
DOWA ELECTRONICS MATERIALS CO (JP)
International Classes:
B22F9/24; B22F1/00; B22F1/103; B22F1/105
Domestic Patent References:
| WO2019117234A1 | 2019-06-20 |
Foreign References:
| JP2011042839A | 2011-03-03 | |||
| US20220055941A1 | 2022-02-24 | |||
| JP2012214873A | 2012-11-08 | |||
| JP2008255378A | 2008-10-23 | |||
| JP2005048236A | 2005-02-24 |
Attorney, Agent or Firm:
SUGIMURA Kenji (JP)
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