SPIRAL CONTACT AND PROCESS FOR PRODUCING THE SAME

Title:

SPIRAL CONTACT AND PROCESS FOR PRODUCING THE SAME

Document Type and Number:

WIPO Patent Application WO/2007/052438

Kind Code:

A1

Abstract:

A process for producing spiral contact (7) that even in an environment of high temperature, exhibits a low permanent set in fatigue and ensures fair spring characteristics, excelling in electrical conductivity. Ni is used as a core metal of spiral contact (7). Dissimilar metal (7b,7b’) deposited on the surface of the core metal, Cu substrate (1) and the core metal in the state of being in contact with each other are heated so as to induce diffusion infiltration of atoms of the dissimilar metal (7b,7b’) and Cu atoms of the Cu substrate (1) into a surface layer of the core metal, thereby forming alloys (7c,7d). Ti or Al is used as the dissimilar metal (7b,7b’) deposited on the surface of the core metal. With respect to the heating temperature, the lower limit thereof is the temperature corresponding to 0.4 time the absolute temperature of melting point of metal with highest melting point among the core metal and dissimilar metal (7b,7b’) disposed in contact with each other while the upper limit thereof is the absolute temperature of melting point of metal with lowest melting point thereamong. Alternatively, Cu is used as the core metal, and a barrier material of Ni is interposed between the core metal and the Cu substrate (1).

Inventors:

HIRAI YUKIHIRO (JP)

Application Number:

PCT/JP2006/320064

Publication Date:

May 10, 2007

Filing Date:

October 06, 2006

Export Citation:

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Assignee:

ADVANCED SYSTEMS JAPAN INC (JP)
HIRAI YUKIHIRO (JP)

International Classes:

H01R43/16; C23C10/28; C23C28/02; C25D1/00; H01R13/03; H01R13/24; H01R33/76

Foreign References:

JP2005032708A	2005-02-03
JPS60105259A	1985-06-10
JPS61183426A	1986-08-16
JPH1081927A	1998-03-31
JPS6217169A	1987-01-26
JP2004179055A	2004-06-24
JP2004179055A	2004-06-24

Other References: