SPLITTER ASSEMBLY WITH HIGH DENSITY BACKPLANE BOARD

WIPO Patent Application WO2003003757

A3

A telecommunications device including a plurality of splitter cards (55) mounted in a chassis (52). The device also includes a circuit board (68) and plurality of card edge connectors (96) for providing electrical connections between the splitter cards and the circuit board. The device further includes POTS connectors, LINE connectors and DATA connectors. The circuit board includes a first layer having first tracings that electrically connect contacts of at least one of the POTS, LINE or DATA connectors to at least one of the card edge connectors; a second layer having second tracings that electrically connect contacts of at least one of the POTS, LINE or DATA connectors to at least one of the card edge connectors; and a third layer having third tracings that electrically connect contacts of at least one of the POTS, LINE or DATA connectors to at least one of the card edge connectors. The second layer is positioned between the first and third layers. A majority of the second layer is covered by a grounding plane. The grounding plane and the second tracings are co-planar such that the grounding plane adds no additional thickness to the second layer. The grounding plane is positioned between the first and third tracings to reduce cross-talk between the first and third tracings.

SCHMOKEL PAUL W

PCT/US2002/019861

June 19, 2003

June 24, 2002

Click for automatic bibliography generation  

ADC TELECOMMUNICATIONS INC (US)

H04Q1/14; H05K1/02; H04Q1/06; (IPC1-7): H04Q1/10; H05K7/00; H04M11/06; H05K1/02

WO2001045432A1

2001-06-21

US5714718A	1998-02-03
US6181004B1	2001-01-30
EP0909102A2	1999-04-14

PATENT ABSTRACTS OF JAPAN vol. 017, no. 193 (E - 1351) 15 April 1993 (1993-04-15)

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