SPLITTING APPARATUS AND CLEAVAGE METHOD FOR BRITTLE MATERIAL

WIPO Patent Application WO/2010/071128

A1

Provided is a splitting apparatus for a brittle material wherein a highly versatile CO2 laser source is used as a laser source, a cleavage rate is widely increased, and full body cleavage in a straight line is possible so that a cleavage surface does not curve with respect to a planned cleavage line.  A row of a first beam radiation region (13), a second beam radiation region (14), and a cooling point (15) is relatively moved along a planned cleavage line (12) on a glass substrate (11).  The first beam radiation region (13) is located forward with respect to the second radiation region (14) in the cleavage direction, the second beam irradiation region (14) is an elongated beam along the planned cleavage line, and the cooling point (15) is located at a position away from the rear end of the second beam radiation region (14) by a predetermined distance.

ENOKIZONO, Hitoshi (6-84-2, Ota-machi, Naka-ku, Yokohama-sh, Kanagawa 11, 〒2310011, JP)
榎園　人士 (〒11 神奈川県横浜市中区太田町六丁目８４番地２株式会社レミ内 Kanagawa, 〒2310011, JP)

JP2009/070900

June 24, 2010

December 15, 2009

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LEMI CO.,LTD. (6-84-2, Ota-machi Naka-ku, Yokohama-sh, Kanagawa 11, 〒2310011, JP)
株式会社レミ (〒11 神奈川県横浜市中区太田町六丁目８４番地２ Kanagawa, 〒2310011, JP)
ENOKIZONO, Hitoshi (6-84-2, Ota-machi, Naka-ku, Yokohama-sh, Kanagawa 11, 〒2310011, JP)

B28D5/00; B23K26/00; B23K26/06; B23K26/073; B23K26/38; C03B33/09

YOSHIDA, Kenji et al. (34-12, Kichijoji-honcho 1-chome Musashino-sh, Tokyo 04, 〒1800004, JP)

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