Title:
SPLITTING APPARATUS AND CLEAVAGE METHOD FOR BRITTLE MATERIAL
Document Type and Number:
WIPO Patent Application WO/2010/071128
Kind Code:
A1
Abstract:
Provided is a splitting apparatus for a brittle material wherein a highly versatile CO2 laser source is used as a laser source, a cleavage rate is widely increased, and full body cleavage in a straight line is possible so that a cleavage surface does not curve with respect to a planned cleavage line. A row of a first beam radiation region (13), a second beam radiation region (14), and a cooling point (15) is relatively moved along a planned cleavage line (12) on a glass substrate (11). The first beam radiation region (13) is located forward with respect to the second radiation region (14) in the cleavage direction, the second beam irradiation region (14) is an elongated beam along the planned cleavage line, and the cooling point (15) is located at a position away from the rear end of the second beam radiation region (14) by a predetermined distance.
Inventors:
ENOKIZONO HITOSHI (JP)
KARUBE NORIO (JP)
KARUBE NORIO (JP)
Application Number:
PCT/JP2009/070900
Publication Date:
June 24, 2010
Filing Date:
December 15, 2009
Export Citation:
Assignee:
LEMI CO LTD (JP)
ENOKIZONO HITOSHI (JP)
KARUBE NORIO (JP)
ENOKIZONO HITOSHI (JP)
KARUBE NORIO (JP)
International Classes:
B28D5/00; B23K26/00; B23K26/06; B23K26/073; B23K26/38; C03B33/09
Foreign References:
| JP2005212364A | 2005-08-11 | |||
| JP2008246808A | 2008-10-16 | |||
| JPH08197271A | 1996-08-06 |
Attorney, Agent or Firm:
YOSHIDA, Kenji et al. (JP)
Kenji Yoshida (JP)
Kenji Yoshida (JP)
Download PDF:
Previous Patent: PHOTOCATALYST AND PROCESS FOR PRODUCING SAME
Next Patent: METHOD FOR MANUFACTURING HYDROXYL GROUP SUBSTITUTION PRODUCT
Next Patent: METHOD FOR MANUFACTURING HYDROXYL GROUP SUBSTITUTION PRODUCT