SPLITTING OF A SOLID USING CONVERSION OF MATERIAL

Title:

SPLITTING OF A SOLID USING CONVERSION OF MATERIAL

Document Type and Number:

WIPO Patent Application WO/2016/083610

Kind Code:

A3

Abstract:

The invention relates to a method for creating a detachment zone (2) in a solid (1) in order to detach a solid portion (12), especially a solid layer (12), from the solid (1), said solid portion (12) that is to be detached being thinner than the solid from which the solid portion (12) has been removed. According to the invention, the method comprises at least the steps of: providing a solid (1) which is to be processed and which is preferably made of a chemical compound; providing a LASER light source; subjecting the solid (1) to LASER radiation from the LASER light source so that the laser beams penetrate into the solid (1) via a surface (5) of the solid portion (12) that is to be cut off; the LASER radiation is applied in a defined manner to a predefined portion of the solid (1) inside the solid (1) such that a detachment zone (2) or a plurality of partial detachment zones (25, 27, 28, 29) is formed; the method is characterized in that a number of modifications (9) is successively created in the crystal lattice by the applied laser radiation, and the crystal lattice fissures at least partially in the regions surrounding the modifications (9) as a result of the modifications (9), said fissures in the region of the modifications (9) predefining the detachment zone (2) or a plurality of partial detachment zones (25, 27, 28, 29).

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Inventors:

RICHTER JAN (DE)
BEYER CHRISTIAN (DE)
RIESKE RALF (DE)

Application Number:

PCT/EP2015/077981

Publication Date:

September 22, 2016

Filing Date:

November 27, 2015

Export Citation:

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Assignee:

SILTECTRA GMBH (DE)

International Classes:

B23K26/00; B23K26/402

Domestic Patent References:

WO2013115352A1	2013-08-08
WO2012074439A2	2012-06-07
WO2013126927A2	2013-08-29

Foreign References:

US5968382A	1999-10-19
EP2346066A1	2011-07-20

Other References: