Title:
SPONGE-FORMING LIQUID SILICONE RUBBER COMPOSITION AND SILICONE RUBBER SPONGE
Document Type and Number:
WIPO Patent Application WO/2018/097125
Kind Code:
A1
Abstract:
[Problem] To provide: a sponge-forming liquid silicone rubber composition that maintains a stable emulsified state, that can form a low-density silicone rubber sponge having a uniform and fine open-cell foam structure even when a coating or molding method involving shearing force and thin layer formation is used, that is less likely to contract during curing, and that forms a silicone rubber sponge having a density close to the density designed on the basis of water content; and a low-density silicone rubber sponge material using the sponge-forming liquid silicone rubber composition. [Solution] Provided are: a sponge-forming liquid silicone rubber composition characterized by comprising (A) an alkenyl group-containing organopolysiloxane, (B) an organopolysiloxane having a silicon atom-bonded hydrogen atom, (C) a mixture of water and an inorganic thickener, (D) an emulsifier, and (E) a hydrosilylation reaction catalyst, the contained amount of the component (C) in the entire composition being 70 mass% or more; and the use thereof.
Inventors:
ENDO SHUJI (JP)
TOYAMA TAKATOSHI (JP)
NOZOE TSUGIO (JP)
TOYAMA TAKATOSHI (JP)
NOZOE TSUGIO (JP)
Application Number:
PCT/JP2017/041795
Publication Date:
May 31, 2018
Filing Date:
November 21, 2017
Export Citation:
Assignee:
DOW CORNING TORAY CO LTD (JP)
International Classes:
C08J9/28; C08K3/34; C08K3/36; C08L83/05; C08L83/07
Domestic Patent References:
| WO2010013847A1 | 2010-02-04 |
Foreign References:
| JP2003096223A | 2003-04-03 | |||
| JP2008214625A | 2008-09-18 | |||
| JP2004346248A | 2004-12-09 | |||
| JP2011168728A | 2011-09-01 | |||
| JP2010150350A | 2010-07-08 | |||
| JP2004346248A | 2004-12-09 | |||
| JP2008214625A | 2008-09-18 | |||
| JPH07118535A | 1995-05-09 |
Other References:
See also references of EP 3546507A4
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