Title:
SPRAY ASSEMBLY, SEMICONDUCTOR DEVICE, AND WAFER PROCESSING METHOD
Document Type and Number:
WIPO Patent Application WO/2024/051405
Kind Code:
A1
Abstract:
A spray assembly, a semiconductor device, and a wafer processing method. An annular spray plate is provided, multiple independent spray regions are formed in an annular region of the spray plate, and the flow rate, concentration and the like of introduced reactants can be respectively adjusted according to requirements; and these spray regions are annularly distributed and can be arranged in an edge region of a central air inlet, the flow rate, concentration and the like of reactants introduced into different spray regions can be respectively adjusted according to requirements, and then the consistency of wafer surface process parameters is adjusted, thereby achieving the objective of improving the uniformity of deposition thicknesses of an edge region and a central region of a wafer.
Inventors:
ZHI SHUNHUA (CN)
XU SUOCHANG (CN)
XU SUOCHANG (CN)
Application Number:
PCT/CN2023/110761
Publication Date:
March 14, 2024
Filing Date:
August 02, 2023
Export Citation:
Assignee:
JIANGSU LEADMICRO NANO TECH CO LTD (CN)
International Classes:
H01J37/32; C23C16/455; C23C16/52; H01L21/205
Foreign References:
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| CN102424956A | 2012-04-25 | |||
| CN114774887A | 2022-07-22 | |||
| CN110176391A | 2019-08-27 | |||
| CN101136322A | 2008-03-05 | |||
| CN101499407A | 2009-08-05 | |||
| CN103590019A | 2014-02-19 | |||
| CN103915306A | 2014-07-09 | |||
| CN113871280A | 2021-12-31 | |||
| CN1359531A | 2002-07-17 | |||
| JP2004214669A | 2004-07-29 |
Attorney, Agent or Firm:
BEIJING YINGKE LAW FIRM (CN)
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