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Patent Searching and Data


Title:
SPRING ASSEMBLY
Document Type and Number:
WIPO Patent Application WO/2014/115750
Kind Code:
A1
Abstract:
In the present invention, it is possible to easily produce a compact compound spring at a low cost. Of a first component, which has a first main body formed by winding a wire in a spiral shape and a first connection section formed at the end of the first main body, and a second component, which has a second connection section connected to the first connection section, the first connection section and second connection section are joined and assembled. As a result, it is possible to form a compound spring.

Inventors:
MURAI, Hidetoshi (25-16, Gokanme-cho, Seya-ku, Yokohama-sh, Kanagawa 08, 〒2460008, JP)
Application Number:
JP2014/051218
Publication Date:
July 31, 2014
Filing Date:
January 22, 2014
Export Citation:
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Assignee:
GOKO HATSUJO CO., LTD. (25-16, Gokanme-cho Seya-ku, Yokohama-sh, Kanagawa 08, 〒2460008, JP)
International Classes:
F16F3/04; F16F1/12
Foreign References:
JPH10509347A
JPS58129353U
FR2652139A1
US5791638A
GB933653A
US20030168792A1
US2001835A
Attorney, Agent or Firm:
SAKATA Yukari (2-5-14, Shinyokohama Kohoku-ku Yokohama-sh, Kanagawa 33, 〒2220033, JP)
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