Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
SPRING ASSEMBLY
Document Type and Number:
WIPO Patent Application WO/2014/115750
Kind Code:
A1
Abstract:
In the present invention, it is possible to easily produce a compact compound spring at a low cost. Of a first component, which has a first main body formed by winding a wire in a spiral shape and a first connection section formed at the end of the first main body, and a second component, which has a second connection section connected to the first connection section, the first connection section and second connection section are joined and assembled. As a result, it is possible to form a compound spring.

More Like This:
JPH062421[Name of device] Push button mechanism
JPS5285682SUPPORTING STRUCTURE FOR ENERGY ABSORPTION
Inventors:
MURAI HIDETOSHI (JP)
Application Number:
PCT/JP2014/051218
Publication Date:
July 31, 2014
Filing Date:
January 22, 2014
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
GOKO HATSUJO CO LTD (JP)
International Classes:
F16F3/04; F16F1/12
Foreign References:
JPH10509347A1998-09-14
JPS58129353U1983-09-01
FR2652139A11991-03-22
US5791638A1998-08-11
GB933653A1963-08-08
US20030168792A12003-09-11
US2001835A1935-05-21
Attorney, Agent or Firm:
SAKATA Yukari (JP)
Sakata connection (JP)
Download PDF:
View/Download PDF      PDF Help



 
Previous Patent: ORGANIC SEMICONDUCTOR MATERIAL FOR SOLUTION PROCESS AND ORGANIC SEMICONDUCTOR DEVICE

Next Patent: ULTRASONIC DIAGNOSIS DEVICE