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Title:
SPRING EXTENDING/RETRACTING MECHANISM, ROBOT, AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/185767
Kind Code:
A1
Abstract:
This spring extending/retracting mechanism (SM) has an outer ring (OR), a wire (WR), a spring (SP), and an outer ring drive mechanism (RPT). The wire (WR) is connected to the outer peripheral surface of the outer ring (OR). The spring (SP) is connected to the outer ring (OR) via the wire (WR). The spring (SP) is compressed due to the wire (WR) being wound around the outer ring (OR). The outer ring drive mechanism (RPT) comes into firm contact with the outer ring (OR) and transmits rotational motive force to the outer ring (OR). The outer ring drive mechanism (RPT) releases the outer ring (OR) from the state of firm contact, allowing the outer ring (OR) to rotate freely.

Inventors:
KUROKAWA KANAKO (JP)
OSHIMA NOBUKI (JP)
Application Number:
PCT/JP2022/002119
Publication Date:
September 09, 2022
Filing Date:
January 21, 2022
Export Citation:
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Assignee:
SONY GROUP CORP (JP)
International Classes:
A63H5/00; A61H23/02; A63H11/00; A63H29/04; B08B7/02; F16H13/14; F16H25/20; F16H31/00; F16H33/02; G06F3/01; H02K7/07
Foreign References:
JP2019513958A2019-05-30
JP2012066323A2012-04-05
JPS5973655A1984-04-25
JP2015229113A2015-12-21
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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