Title:
SPRING PROBE ASSEMBLIES
Document Type and Number:
WIPO Patent Application WO2002008770
Kind Code:
A3
Abstract:
A spring probe assembly 10 which contains spring probes 50 and 60 used for mating to various planar devices, such as a printed circuit board, via spring contact with interface areas on their surfaces. The assembly 10 is comprised of a non-metallic, insulating material block 20 which has been crafted to secure multiple, impedance matched, coaxial spring probe assemblies 50 and ground spring pins 60. A metallic clip 70 is used to join the signal probe shield 54 with the ground spring pin 62 in the appropriate geometry, while isolating that signal probe shield 54 and ground spring pin 62 from all other signal probe shields 54 and ground pins 62. The pins 52 of the signal probes 50 make contact with the surfaces of various planar devices via back pressure applied to the pins 52.
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Inventors:
BECKOUS FRANK (US)
Application Number:
PCT/US2001/023391
Publication Date:
April 25, 2002
Filing Date:
July 25, 2001
Export Citation:
Assignee:
GORE ENTERPRISE HOLDINGS INC (US)
International Classes:
H01R13/652; G01R1/067; G01R1/073
Foreign References:
| US6037787A | 2000-03-14 | |||
| US4724180A | 1988-02-09 |
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