Title:
SPUNBOND NON-WOVEN FABRIC WITH IMPROVED OPENING QUALITY AND NO HAZARDOUS RESIDUE, AND MANUFACTURING METHOD AND APPARATUS THEREOF
Document Type and Number:
WIPO Patent Application WO/2022/055131
Kind Code:
A1
Abstract:
The present invention relates to spunbond non-woven fabric containing no hazardous residue and having improved opening quality, and to method and apparatus for producing the spunbond non-woven fabric. The method for producing the spunbond non-woven fabric according to the present invention comprises the step of obtaining filaments that are opened by colliding the continuous filament bundles against metal material containing bismuth (Bi) or bismuth alloy, causing triboelectrification to occur.
Inventors:
PARK YOUNG-SHIN (KR)
LEE MIN-HO (KR)
CHO HEE-JUNG (KR)
CHOI WOO-SEOK (KR)
KANG DONGHEON (KR)
JANG JUNG-SOON (KR)
LEE MIN-HO (KR)
CHO HEE-JUNG (KR)
CHOI WOO-SEOK (KR)
KANG DONGHEON (KR)
JANG JUNG-SOON (KR)
Application Number:
PCT/KR2021/010410
Publication Date:
March 17, 2022
Filing Date:
August 06, 2021
Export Citation:
Assignee:
KOLON INC (KR)
International Classes:
D04H3/147; D04H3/007; D04H3/011
Foreign References:
| JPH0593353A | 1993-04-16 | |||
| JPH08158232A | 1996-06-18 | |||
| KR101441593B1 | 2014-09-19 | |||
| JP2008159374A | 2008-07-10 | |||
| KR20190066019A | 2019-06-12 |
Attorney, Agent or Firm:
YOU ME PATENT AND LAW FIRM (KR)
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