Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
SPUNBOND NONWOVEN FABRIC MANUFACTURING METHOD AND MANUFACTURING DEVICE
Document Type and Number:
WIPO Patent Application WO/2017/038977
Kind Code:
A1
Abstract:
This method for manufacturing a spunbond nonwoven fabric is a method in which a continuous fiber group discharged from a spinneret is thinned and drawn by a rectangular ejector and gathered into the form of a nonwoven fabric, wherein the method for manufacturing a spunbond nonwoven fabric is characterized in that: an ejection port portion of the rectangular ejector is provided with a pair of slit width restricting parts, which face each other in continuation in the long-side direction of the ejection port; at least one of the slit width restricting parts is a slit width restricting member comprising an integrated item continuous in the long-side direction of the ejection port; a plurality of minute deformation means for causing the slit width restricting member to minutely deform are disposed in the long-side direction of the slit width restricting member; the basis weight distribution in the width direction of the nonwoven fabric gathered in advance is measured; the slit width restricting member is caused by the minute deformation means to partially minutely deform on the basis of the resulting measurement value; and the slit width of the ejection port is partially varied by the minute deformation to adjust the basis weight distribution.

Inventors:
SHIMADA DAIKI (JP)
HANE RYOICHI (JP)
SHINWASHI HIROSHI (JP)
INOUE SHINJI (JP)
Application Number:
PCT/JP2016/075803
Publication Date:
March 09, 2017
Filing Date:
September 02, 2016
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
TORAY INDUSTRIES (JP)
International Classes:
D04H1/736; D04H3/16
Foreign References:
JPH09228223A1997-09-02
JPS5259775A1977-05-17
JPH07268720A1995-10-17
JP2001207368A2001-08-03
JPH1025650A1998-01-27
JPH08226063A1996-09-03
Other References:
See also references of EP 3346037A4
Attorney, Agent or Firm:
EIKOH PATENT FIRM, P.C. (JP)
Download PDF: