Title:
SPUTTER TARGETS
Document Type and Number:
WIPO Patent Application WO2002031218
Kind Code:
B1
Abstract:
The invention encompasses a method of forming a container-shaped physical vapor deposition target. A conductive material (56) is provided in a container-shape. The container-shape comprises an interior region and an exterior region, and the conductive material comprises an interior surface along the interior region as well as an exterior surface alon44the exterior region. A sputtering material is electrolytically deposited on at least one of the interior and exterior surfaces of the container-shaped conductive material. The invention also encompasses a container-shaped physical vapor deposition target. The target includes a first conductive material in a container-shape, with the container-shape comprising an interior region and an exterior region. The first conductive material comprises an interior surface (62) along the interior region of the container-shape and an exterior surface (64) along the exterior region of the container shape. The physical vapor deposition target further includes a second conductive material on an entirety of at least one of the interior and exterior surfaces of the first conductive material, with the second conductive material having at least one different metallurgical property than the first conductive material.
Inventors:
LI JIANXING
PINTER MICHAEL R
WU CHI TSE
PINTER MICHAEL R
WU CHI TSE
Application Number:
PCT/US2001/032019
Publication Date:
March 20, 2003
Filing Date:
October 11, 2001
Export Citation:
Assignee:
HONEYWELL INT INC (US)
International Classes:
C23C14/34; C25D7/04; (IPC1-7): C23C14/34; H01J37/34; C25D7/04
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