Title:
SPUTTERING APPARATUS FILM FORMATION UNIT
Document Type and Number:
WIPO Patent Application WO/2018/003615
Kind Code:
A1
Abstract:
Provided is a sputtering apparatus film formation unit that has a simple structure and is easy to maintain without interfering with the function of free target movement relative to a magnet unit. On a support plate 1, this sputtering apparatus film formation unit FU is provided with targets 2 to which backing plates 3 are bonded, magnet units 5, and a driving means 8 for reciprocating the targets 2 with respect to the magnet units along the support plate. Supply tubes 32 and discharge tubes 33 that open into coolant passages 31 of the backing plates are installed in a protruding manner in the backing plates, and slits 13, into which the supply tubes and discharge tubes are inserted and which are long in the direction of the reciprocating motion of the targets, are opened in the support plate. The lower surface of the support plate is provided with cap bodies 71, which encompass the slits and surround the portions of the supply tubes and the discharge tubes that protrude downward from the slits in an airtight manner. The respective portions of the supply tubes and the discharge tubes that protrude from the cap bodies in the direction of the reciprocating motion are inserted into bellows tubes 72 and are connected to the driving parts of the driving means.
Inventors:
SAITOU SHUUJI (JP)
Application Number:
PCT/JP2017/022797
Publication Date:
January 04, 2018
Filing Date:
June 21, 2017
Export Citation:
Assignee:
ULVAC INC (JP)
International Classes:
C23C14/35; C23C14/34
Foreign References:
| JPH01111870A | 1989-04-28 | |||
| JP2000268995A | 2000-09-29 | |||
| JP2013209690A | 2013-10-10 | |||
| JPS5295581A | 1977-08-11 |
Attorney, Agent or Firm:
SEIGA PATENT AND TRADEMARK CORPORATION (JP)
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