Title:
SPUTTERING DEVICE AND FILM FORMATION METHOD USING SAME
Document Type and Number:
WIPO Patent Application WO/2013/024641
Kind Code:
A1
Abstract:
A sputtering device for forming an electroconductive film (103) on a treated substrate (100) by a sputtering process comprises a treatment chamber, conveyance rollers (3) which include a metal roller base part (3L) and a resin member (3R) that is provided on the entire circumference of the roller base part (3L), and a conducting part (3S) which electrically conducts with the roller base part (3L) while coating the surface of the resin member (3R). During formation of the electroconductive film (103) on the treated substrate (100) in the treatment chamber, the treated substrate (100) is brought into contact with the conducting part (3S) and conveyed by the conveyance rollers (3), and is subjected to sputtering while the electricity thereof is removed through the conducting part (3S). In this sputtering device, abnormal discharge can be suppressed by continuously removing the electricity from the treated substrate beginning at the initial stage of film formation.
Inventors:
KUGE KENTAROH
KAJITA EISAKU
KAJITA EISAKU
Application Number:
PCT/JP2012/067069
Publication Date:
February 21, 2013
Filing Date:
July 04, 2012
Export Citation:
Assignee:
SHARP KK (JP)
KUGE KENTAROH
KAJITA EISAKU
KUGE KENTAROH
KAJITA EISAKU
International Classes:
C23C14/34
Foreign References:
| JPH06204536A | 1994-07-22 | |||
| JP2008069402A | 2008-03-27 | |||
| US20100163406A1 | 2010-07-01 | |||
| JP2006248627A | 2006-09-21 | |||
| JPH10204629A | 1998-08-04 | |||
| JPH06250162A | 1994-09-09 | |||
| JP2001176946A | 2001-06-29 | |||
| JP2002274642A | 2002-09-25 | |||
| JPH10280142A | 1998-10-20 |
Attorney, Agent or Firm:
Fukami Patent Office, p. c. (JP)
Patent business corporation Fukami patent firm (JP)
Patent business corporation Fukami patent firm (JP)
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Claims: