Title:
SPUTTERING DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/093650
Kind Code:
A1
Abstract:
The present invention relates to a sputtering device, comprising a reaction chamber, in which a base for bearing a workpiece to be processed is provided. The sputtering device further comprises: an ejection pin mechanism, which is disposed in the reaction chamber and is capable of doing a lifting motion relative to the base, so as to jack up from the base and bear the workpiece; and a microwave heating mechanism disposed in the reaction chamber and comprising a mobile unit and a microwave emitter connected to the mobile unit, wherein the mobile unit is used for moving, when the workpiece is borne by the ejection pin mechanism, the microwave emitter to a position below the workpiece so that the microwave emitter can heat the workpiece by emitting microwaves to the workpiece. According to the sputtering device provided in the embodiments of the present invention, heating rate can be improved such that the workpiece to be processed can be heated rapidly; thus, the cycle time of a reflow process is effectively shortened and production efficiency is improved.
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Inventors:
LI MOLIN (CN)
Application Number:
PCT/CN2020/126456
Publication Date:
May 20, 2021
Filing Date:
November 04, 2020
Export Citation:
Assignee:
BEIJING NAURA MICROELECTRONICS EQUIPMENT CO LTD (CN)
International Classes:
C23C14/34; C23C14/35; C23C14/54
Foreign References:
| CN110923642A | 2020-03-27 | |||
| CN104746031A | 2015-07-01 | |||
| JP2019112665A | 2019-07-11 | |||
| CN105714245A | 2016-06-29 | |||
| CN107227448A | 2017-10-03 | |||
| EP0092346A1 | 1983-10-26 |
Attorney, Agent or Firm:
TEE&HOWE INTELLECTUAL PROPERTY ATTORNEYS (CN)
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