SPUTTERING SOURCE AND CYLINDRICAL SPUTTERING DEVICE COMPRISING SAME

WIPO Patent Application WO/2013/183804

A1

The sputtering source of a sputtering device may comprise: a cylindrical target which is formed so as to be hollow and is provided so as to be able to rotate; a magnet-support part which is disposed inside of the cylindrical target; a magnet member which is disposed on the magnet-support part and applies a magnetic field around the cylindrical target; and a power-source connecting unit which supplies a power source to the cylindrical target and incorporates a contacting part for making contact with the rotating cylindrical target in a rolling fashion and incorporates a charging part for charging the area around the contacting part with an electrically-conductive fluid. Consequently, power can be stably supplied by using the power-source connecting unit even though the cylindrical target is rotating.

JPH08506855	[Title of Invention] Shield structure of cylindrical magnetron
WO/2021/016620	PULSED DC SPUTTERING SYSTEMS AND METHODS
JP3955744	METHOD FOR PRODUCING ORGANIC THIN FILM ELEMENT

HONG JAE SUK (KR)
CHOI IL SIK (KR)
YI JAE HWAN (KR)
WOO KYOUNG JIN (KR)
BANG TAE BOK (KR)
YOUN HYON O (KR)
JUNG CHAN SOO (KR)
PARK JAE WAN (KR)

PCT/KR2012/004668

December 12, 2013

June 13, 2012

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CTC CO LTD (KR)
HONG JAE SUK (KR)
CHOI IL SIK (KR)
YI JAE HWAN (KR)
WOO KYOUNG JIN (KR)
BANG TAE BOK (KR)
YOUN HYON O (KR)
JUNG CHAN SOO (KR)
PARK JAE WAN (KR)

C23C14/35

KR20110104363A	2011-09-22
US20050224343A1	2005-10-13
KR20060111896A	2006-10-30

LEE, DONG GUN (KR)
이동건 (KR)

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