Title:
SPUTTERING TARGET-BACKING PLATE ASSEMBLY BODY
Document Type and Number:
WIPO Patent Application WO/2011/102359
Kind Code:
A1
Abstract:
A sputtering target-backing plate assembly body is characterized in that a raw material powder prepared so as to match the composition of a magnetic material sputtering target is filled in a die together with a backing plate and is hot-pressed, thereby being bonded to the backing plate simultaneously with sintering of the magnetic material target powder. By disposing the raw material powder of the target on the backing plate and sintering, the sputtering target-backing plate assembly body can obtain a high average pass through flux (PTF) and can be sputtered more stably. Also, by simultaneously performing sintering and bonding, the sputtering target-backing plate assembly body has a short manufacturing process, can shorten the manufacturing period, and does not cause the peeling problem due to temperature increase during sputtering. In addition, the sputtering target-backing plate assembly body makes it possible to reduce cost and improve the PTF.
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Inventors:
IKEDA YUKI (JP)
NAKAMURA YUICHIRO (JP)
ARAKAWA ATSUTOSHI (JP)
NAKAMURA YUICHIRO (JP)
ARAKAWA ATSUTOSHI (JP)
Application Number:
PCT/JP2011/053211
Publication Date:
August 25, 2011
Filing Date:
February 16, 2011
Export Citation:
Assignee:
JX NIPPON MINING & METALS CORP (JP)
IKEDA YUKI (JP)
NAKAMURA YUICHIRO (JP)
ARAKAWA ATSUTOSHI (JP)
IKEDA YUKI (JP)
NAKAMURA YUICHIRO (JP)
ARAKAWA ATSUTOSHI (JP)
International Classes:
C23C14/34; B22F3/14; B22F7/08; C04B35/00; C04B35/622; C22C1/04; C22C1/05; C22C5/04; C22C19/07; C22C33/02; C22C38/00
Domestic Patent References:
| WO2007080781A1 | 2007-07-19 |
Foreign References:
| US5397050A | 1995-03-14 | |||
| US5215639A | 1993-06-01 | |||
| JP2000506218A | 2000-05-23 | |||
| JPH0586460A | 1993-04-06 |
Attorney, Agent or Firm:
OGOSHI ISAMU (JP)
Isamu Ogoshi (JP)
Isamu Ogoshi (JP)
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Claims: