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Patent Searching and Data


Title:
SPUTTERING TARGET, SPUTTERING TARGET MANUFACTURING METHOD, BARIUM TITANATE THIN FILM MANUFACTURING METHOD, AND THIN FILM CAPACITOR MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2013/150831
Kind Code:
A1
Abstract:
This sputtering target is provided with a conductive barium titanate sintered material with an occurrence density of less than 0.2 per cm2 of crystal grain aggregates (12) having a grain diameter of 10μm or greater in a cleaved surface.

Inventors:
ADACHI Kiwamu (1-7-1 Konan, Minato-k, Tokyo 75, 〒1080075, JP)
YANAGAWA Shusaku (1-7-1 Konan, Minato-k, Tokyo 75, 〒1080075, JP)
Application Number:
JP2013/054696
Publication Date:
October 10, 2013
Filing Date:
February 25, 2013
Export Citation:
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Assignee:
SONY CORPORATION (1-7-1, Konan Minato-k, Tokyo 75, 〒1080075, JP)
International Classes:
C23C14/34; H01G4/12; H01G4/33; H01L21/822; H01L27/04
Foreign References:
JP2006256934A
JP2000256837A
JPH09316630A
JPH07109566A
JPH09249967A
JPH07173621A
JPH0754137A
Attorney, Agent or Firm:
TSUBASA PATENT PROFESSIONAL CORPORATION (3F Sawada Building, 15-9 Shinjuku 1-chome, Shinjuku-k, Tokyo 22, 〒1600022, JP)
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