Title:
SPUTTERING TARGET MATERIAL
Document Type and Number:
WIPO Patent Application WO/2017/047754
Kind Code:
A1
Abstract:
The purpose of the present invention is to improve the mechanical strength of a sputtering target. Provided to achieve this purpose is a sputtering target material that is characterized by containing B in a proportion of 10-50 at.% and at least one element selected from Ti, Zr, Hf, V, Nb, Ta, Cr, Mo, W, Mn, Re, Ru, Rh, Ir, Ni, Pd, Pt, Cu, and Ag in a combined proportion of 0-20 at.%, and is further characterized in that the remainder comprises unavoidable impurities and at least one of Co and Fe, and the hydrogen content does not exceed 20 ppm.
More Like This:
| JPS6455378 | FILM FORMING DEVICE |
| JP2001025666 | LAMINATE AND ITS PRODUCTION |
| JP2010084169 | EVACUATION METHOD, EVACUATION PROGRAM, AND VACUUM TREATMENT APPARATUS |
Inventors:
HASEGAWA HIROYUKI (JP)
MATSUBARA NORIAKI (JP)
MATSUBARA NORIAKI (JP)
Application Number:
PCT/JP2016/077459
Publication Date:
March 23, 2017
Filing Date:
September 16, 2016
Export Citation:
Assignee:
SANYO SPECIAL STEEL CO LTD (JP)
International Classes:
C23C14/34; C22C1/04; C22C19/07; C22C30/00; C22C33/02; C22C38/00
Domestic Patent References:
| WO2015080009A1 | 2015-06-04 | |||
| WO2015019513A1 | 2015-02-12 | |||
| WO2016140113A1 | 2016-09-09 | |||
| WO2015166762A1 | 2015-11-05 |
Foreign References:
| JP2012207274A | 2012-10-25 | |||
| JP2003226963A | 2003-08-15 |
Other References:
See also references of EP 3351655A4
Attorney, Agent or Firm:
NAGAI Hiroshi et al. (JP)
Download PDF: