Title:
SPUTTERING TARGET AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2015/002253
Kind Code:
A1
Abstract:
Provided is a sputtering target having a target material in which providing a dense substance and reducing the amount of wax used makes it possible to perform stable film formation operation and manufacturing costs to be reduced. A sputtering target (1) provided with a target material (4) on the surface of a cylindrical substrate (2) interposed by a wax (3), wherein the target material (4) is a dense substance having a porosity of no more than 1.5%, and the thickness of the wax (3) being no more than 0.2 mm. This sputtering target (1) can be manufactured by a simple operation using cold isostatic pressing.
Inventors:
KANDA KOUICHI (JP)
HAYASI KYOUSUKE (JP)
KINOSHITA SHUICHI (JP)
ISHIKAWA TAKUYA (JP)
FUKUSHIMA SATOSHI (JP)
HAYASI KYOUSUKE (JP)
KINOSHITA SHUICHI (JP)
ISHIKAWA TAKUYA (JP)
FUKUSHIMA SATOSHI (JP)
Application Number:
PCT/JP2014/067711
Publication Date:
January 08, 2015
Filing Date:
July 02, 2014
Export Citation:
Assignee:
AGC CERAMICS CO LTD (JP)
International Classes:
C23C14/34
Foreign References:
| JPH05230645A | 1993-09-07 | |||
| JP2006138006A | 2006-06-01 | |||
| JPH11511510A | 1999-10-05 | |||
| JPH0586462A | 1993-04-06 | |||
| JP2010150610A | 2010-07-08 | |||
| JP2011084795A | 2011-04-28 |
Other References:
See also references of EP 3018234A4
Attorney, Agent or Firm:
SENMYO, Kenji et al. (JP)
Spring name Kenji (JP)
Spring name Kenji (JP)
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