Title:
STACKED BODY, STACKED BODY MANUFACTURING METHOD, AND CAPACITIVE INPUT DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/066405
Kind Code:
A1
Abstract:
Provided are a stacked body having excellent adhesion between an oxide particle-containing layer and a resin layer over a base material, a stacked body manufacturing method, and a capacitive input device. The stacked body comprises: a base material; an oxide particle-containing layer including at least one type of metal oxide particles selected from the group consisting of titanium oxide particles and zirconium oxide particles; and a resin layer which is a cured product of a photosensitive composition disposed on a surface of the oxide particle-containing layer, and which has an internal stress of less than or equal to 1.0 MPa, wherein a crosslinking density of an ethylenic unsaturated group in a first upper-layer portion including a surface in contact with the oxide particle-containing layer is equal to or more than 1.2 mmol/g. The stacked body manufacturing method comprises a step of forming a photosensitive layer and a step of forming a resin layer.
Inventors:
SHIMOYAMA TATSUYA (JP)
OGAWA KYOHEI (JP)
OGAWA KYOHEI (JP)
Application Number:
PCT/JP2019/033197
Publication Date:
April 02, 2020
Filing Date:
August 26, 2019
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
B32B27/18; B32B27/00; G03F7/004; G03F7/027; G03F7/031; G06F3/041
Domestic Patent References:
| WO2018105313A1 | 2018-06-14 |
Foreign References:
| JP2018024226A | 2018-02-15 | |||
| JP2017181541A | 2017-10-05 |
Attorney, Agent or Firm:
NAKASHIMA Junko et al. (JP)
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