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Patent Searching and Data


Title:
STACKED LENS STRUCTURE, METHOD OF MANUFACTURING THE SAME, AND ELECTRONIC APPARATUS
Document Type and Number:
WIPO Patent Application WO/2017/022188
Kind Code:
A1
Abstract:
A deformation of a stacked lens is suppressed. A stacked lens structure has a configuration in which substrates with lenses having a lens disposed on an inner side of a through-hole formed in the substrate are bonded and stacked by direct bonding. The present technique can be applied to a camera module or the like in which a stacked lens structure in which at least three substrates with lenses including first to third substrates with lenses which are substrates with lenses in which a through-hole is formed in the substrate and a lens is formed on an inner side of the through-hole is integrated with a light receiving element, for example.

Inventors:
MATSUGAI HIROYASU (JP)
ITOU HIROYUKI (JP)
SAITO SUGURU (JP)
OHSHIMA KEIJI (JP)
IWASAKI MASANORI (JP)
HAYASHI TOSHIHIKO (JP)
SATO SHUZO (JP)
FUJII NOBUTOSHI (JP)
TAZAWA HIROSHI (JP)
SHIRAIWA TOSHIAKI (JP)
ISHIDA MINORU (JP)
Application Number:
PCT/JP2016/003350
Publication Date:
February 09, 2017
Filing Date:
July 15, 2016
Export Citation:
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Assignee:
SONY CORP (JP)
International Classes:
G02B13/00; B29D11/00; G02B1/11; H01L27/146
Foreign References:
US20100283113A12010-11-11
EP2667225A12013-11-27
US20080181558A12008-07-31
JP2014112116A2014-06-19
US20110249350A12011-10-13
US20100253832A12010-10-07
EP2190025A12010-05-26
JP2009279790A2009-12-03
JP2011138089A2011-07-14
JP2010256563A2010-11-11
JP2013001091A2013-01-07
JP2010204631A2010-09-16
JP2015102794A2015-06-04
Other References:
CHENG ZHENGXI ET AL: "Infrared absorption mechanisms of black silicon", OPTOMECHATRONIC MICRO/NANO DEVICES AND COMPONENTS III : 8 - 10 OCTOBER 2007, LAUSANNE, SWITZERLAND; [PROCEEDINGS OF SPIE , ISSN 0277-786X], SPIE, BELLINGHAM, WASH, vol. 9284, 2 September 2014 (2014-09-02), pages 92840S - 92840S, XP060040941, ISBN: 978-1-62841-730-2, DOI: 10.1117/12.2069604
Attorney, Agent or Firm:
NISHIKAWA, Takashi et al. (JP)
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