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Title:
STAMPING PUNCH DIE CAPABLE OF ADJUSTING INITIAL LOAD OF COIL SPRING IN ACCORDANCE WITH MATERIAL QUALITY OF WORKPIECE, STAMPING DIE SET, AND CHAMFERING METHOD
Document Type and Number:
WIPO Patent Application WO/2018/025735
Kind Code:
A1
Abstract:
Provided are: a stamping punch die that is capable of improving the operation performance of a stamping process such as chamfering by adjusting the initial load of a coil spring in accordance with the material quality of a workpiece; a stamping die set; and a chamfering method. A punch body 25 is provided inside a punch guide 17 so as to be able to be elevated or lowered, and a punch head 33 is provided so as to be screwed on the upper end of the punch body 25. A coil spring 49 is provided between an upper free ball bearing 41 and the punch body 25 inside the punch guide 17. An annular connection member 51 is provided to the upper side of the punch guide 17 on the outer peripheral surface side of the punch body 25. The connection member 51 is connected to the punch head 33 so as not to be rotatable about an axis C and not to be detachable. An operation member 63 switches the connection member 51 between the state of being rotatable about the axis C with respect to the punch guide 17 and the state of not being rotatable.

Inventors:
OTSUKA Yasuyuki (200 Ishida, Isehara-shi Kanagawa, 96, 〒2591196, JP)
Application Number:
JP2017/027162
Publication Date:
February 08, 2018
Filing Date:
July 27, 2017
Export Citation:
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Assignee:
AMADA HOLDINGS CO.,LTD. (200 Ishida, Isehara-shi Kanagawa, 96, 〒2591196, JP)
International Classes:
B21D19/00; B21C51/00; B21D22/02; B21D28/00; B21D28/36
Attorney, Agent or Firm:
MIYOSHI Hidekazu et al. (Toranomon Kotohira Tower, 2-8 Toranomon 1-chome, Minato-k, Tokyo 01, 〒1050001, JP)
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