Title:
STIFFENER
Document Type and Number:
WIPO Patent Application WO/2019/135367
Kind Code:
A1
Abstract:
[Problem] To provide a stiffener comprising a polyimide film laminate with more excellent heat resistance and rigidity than a polyimide film of a single layer-thick body, and to provide a production method thereof.
[Solution] The polyimide film surface is activated, and subsequently subjected to silane coupling agent treatment. Subsequently, the obtained silane coupling agent-treated polyimide films are stacked on each other, and pressurized and heated to obtain a polyimide film laminate. The obtained polyimide film laminate has a cross-sectional structure comprising alternating polyimide film layers and silane coupling agent condensate layers. This polyimide film laminate has a high modulus of elasticity of 0.5 GPa or higher, even at 400°C.
Inventors:
TOKUDA KAYA (JP)
YAMASHITA MASAHIRO (JP)
OKUYAMA TETSUO (JP)
WATANABE NAOKI (JP)
TSUCHIYA TOSHIYUKI (JP)
ICHIMURA SHUNSUKE (JP)
HAYASHI MIYUKI (JP)
YAMASHITA MASAHIRO (JP)
OKUYAMA TETSUO (JP)
WATANABE NAOKI (JP)
TSUCHIYA TOSHIYUKI (JP)
ICHIMURA SHUNSUKE (JP)
HAYASHI MIYUKI (JP)
Application Number:
PCT/JP2018/047212
Publication Date:
July 11, 2019
Filing Date:
December 21, 2018
Export Citation:
Assignee:
TOYO BOSEKI (JP)
International Classes:
B32B27/34; B32B27/00; H05K1/02; H05K1/03
Domestic Patent References:
| WO2017188174A1 | 2017-11-02 | |||
| WO2012050072A1 | 2012-04-19 | |||
| WO2014014043A1 | 2014-01-23 | |||
| WO2016031746A1 | 2016-03-03 |
Foreign References:
| JPH0513902A | 1993-01-22 | |||
| JP4123665B2 | 2008-07-23 |
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