Title:
STRAIN SENSOR CHIP MOUNTING STRUCTURE, STRAIN SENSOR CHIP, AND METHOD FOR PRODUCING STRAIN SENSOR CHIP MOUNTING STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2013/160989
Kind Code:
A1
Abstract:
Whenever a metal bonding material such as a solder is used to bond together a strain sensor chip and an object to be measured, the metal bonding material brings about a creeping behavior if used in a high-temperature environment, e.g., 100°C or higher; therefore, the strain detected with the strain sensor chip gradually decreases, and measurements taken appear as though the strain is decreasing. In a strain sensor chip mounting structure in one aspect of the present application, a strain sensor chip is fixed via a metal bonding material to the surface to be measured of the object to be measured. The metal bonding material is bonded to a metal film formed on a side surface of the strain sensor chip. This makes it possible to minimize changes over time in the measurement error.
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Inventors:
OHTA HIROYUKI (JP)
ASHIDA KISHO (JP)
ASHIDA KISHO (JP)
Application Number:
PCT/JP2012/060859
Publication Date:
October 31, 2013
Filing Date:
April 23, 2012
Export Citation:
Assignee:
HITACHI LTD (JP)
OHTA HIROYUKI (JP)
ASHIDA KISHO (JP)
OHTA HIROYUKI (JP)
ASHIDA KISHO (JP)
International Classes:
G01B7/16; G01L1/18; H01L21/52
Foreign References:
| JPS56118375A | 1981-09-17 | |||
| JPS557323U | 1980-01-18 | |||
| JP2009044123A | 2009-02-26 | |||
| JP2008166579A | 2008-07-17 |
Attorney, Agent or Firm:
TSUTSUI, YAMATO (JP)
Tsutsui Daiwa (JP)
Tsutsui Daiwa (JP)
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