Title:
STRESS MEASUREMENT DEVICE, STRESS MEASUREMENT SYSTEM, AND STRESS MEASUREMENT METHOD
Document Type and Number:
WIPO Patent Application WO/2018/198702
Kind Code:
A1
Abstract:
The stress measurement device according to the present invention is provided with a first acquiring unit for acquiring heat data including information indicating the temperature of a measurement region of a measurement object, a second acquiring unit for acquiring data related to stress occurring in a single region within the measurement region, and a control unit for calculating the stress occurring in the measurement region of the measurement object from the heat data and the data relating to stress. The control unit calculates first waveform data on the basis of a temporal variation in the heat data for each of the single region within the measurement region and another region other than the single region, and calculates second waveform data on the basis of a temporal variation in the data relating to stress. The control unit subtracts the second waveform data from the first waveform data for the single region within the measurement region and calculates disturbance data, and subtracts the disturbance data from the first waveform data for the other region within the measurement region and thereby calculates stress data indicating stress occurring in the other region.
Inventors:
IRIE YOUSUKE
Application Number:
PCT/JP2018/014514
Publication Date:
November 01, 2018
Filing Date:
April 05, 2018
Export Citation:
Assignee:
PANASONIC IP MAN CO LTD (JP)
International Classes:
G01L1/00; G01N25/20; G01N25/72
Foreign References:
| JP5696643B2 | 2015-04-08 | |||
| US5719395A | 1998-02-17 |
Other References:
See also references of EP 3460431A4
Attorney, Agent or Firm:
KAMATA Kenji et al. (JP)
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