STRESS PROPERTIES MEASUREMENT METHOD, STRESS PROPERTIES MEASUREMENT DEVICE, AND STRESS PROPERTIES MEASUREMENT SYSTEM

Title:

STRESS PROPERTIES MEASUREMENT METHOD, STRESS PROPERTIES MEASUREMENT DEVICE, AND STRESS PROPERTIES MEASUREMENT SYSTEM

Document Type and Number:

WIPO Patent Application WO/2020/183830

Kind Code:

A1

Abstract:

This stress properties measurement method measures the properties of stresses generated in a structure and comprises: a step for acquiring, from a first imaging device, a plurality of thermal images in accordance with the surface temperature of the structure and having imaging times differing from one another; a step for generating stress distribution images corresponding to each of the plurality of thermal images; a step for acquiring, in each of the stress distribution images, a stress value of a first section in which a stress gradient is less than a prescribed value and respective stress values of a plurality of second sections in which stress is concentrated; and a step for using the stress value of the first section and the respective stress values of the plurality of second sections to derive the correlation properties of stresses in the sections of the structure.

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Inventors:

IRIE YOUSUKE

Application Number:

PCT/JP2019/048746

Publication Date:

September 17, 2020

Filing Date:

December 12, 2019

Export Citation:

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Assignee:

PANASONIC IP MAN CO LTD (JP)

International Classes:

G01L1/00; G01M99/00; G01N25/00

Domestic Patent References:

WO2018198702A1	2018-11-01
WO2017141294A1	2017-08-24

Foreign References:

JP2017036978A	2017-02-16
US20120029840A1	2012-02-02
JP2008232708A	2008-10-02
JP2000249638A	2000-09-14

Other References: