STRESS TREATMENT DEVICE AND OPERATION SYSTEM

WIPO Patent Application WO/2010/137340

A1

A stress treatment device is comprised of an operation portion provided with a head portion which performs peening to irradiate the inside of a hole formed in a structure with a laser so that a compression stress area is formed inside the hole; a laser portion having an optical fiber for introducing the laser to the head portion; an injection portion for injecting liquid to the inside of the hole; and a support portion which supports the optical fiber so that the injected liquid can pass through the support portion and which is fixed within the head portion.

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SASAKI HIDEKAZU (JP)
CHIDA ITARU (JP)
MURAKAMI ITARU (JP)
NOMURA HIROSHI (JP)

PCT/JP2010/003599

December 02, 2010

May 28, 2010

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TOSHIBA KK (JP)
SASAKI HIDEKAZU (JP)
CHIDA ITARU (JP)
MURAKAMI ITARU (JP)
NOMURA HIROSHI (JP)

F01D25/00; B23K26/02; B23K26/03; B23K26/064; B23K26/14; B23K26/16; C23C26/00; F01D5/30

JP2005313191A	2005-11-10
JPS63248901A	1988-10-17
JP2007030008A	2007-02-08
JP2008087029A	2008-04-17

SAKURA PATENT OFFICE, p. c. (JP)
Patent business corporation cherry tree international patent firm (JP)

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