Title:
STRETCHABLE WIRING SUBSTRATE AND METHOD FOR MANUFACTURING STRETCHABLE WIRING SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2017/183247
Kind Code:
A1
Abstract:
A stretchable wiring substrate (100), provided with: a stretchable substrate (10); stretchable wiring parts (20) formed on the stretchable substrate (10); a reinforcing substrate (30) having a higher in-plane rigidity than the stretchable substrate (10); draw-out wiring parts (40) formed on the reinforcing substrate (30) and electrically connected to the stretchable wiring parts (20); and an elastomer layer (50) formed on the reinforcing substrate (30). The reinforcing substrate (30) overlaps a partial region (10a) of the stretchable substrate (10). The other region (10b) of the stretchable substrate (10) is exposed from the reinforcing substrate (30). The stretchable wiring parts (20) extend from atop the other region (10b) onto the partial region (10a). One elastomer layer (50) and the stretchable substrate (10) are laminated and joined to each other.
Inventors:
IWASE MASAYUKI (JP)
WAKABAYASHI TAKEO (JP)
MIZUNO EIJI (JP)
WAKABAYASHI TAKEO (JP)
MIZUNO EIJI (JP)
Application Number:
PCT/JP2017/003215
Publication Date:
October 26, 2017
Filing Date:
January 30, 2017
Export Citation:
Assignee:
NIPPON MEKTRON KK (JP)
International Classes:
H05K1/14; B32B25/00; B32B27/00; H05K1/03; H05K3/28; H05K3/36
Foreign References:
| JP2012033597A | 2012-02-16 | |||
| JPS5527269Y2 | 1980-06-30 |
Attorney, Agent or Firm:
MIGITA, Shunsuke (JP)
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