Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
STRIPPER SOLUTIONS AND METHODS OF USING STRIPPER SOLUTIONS
Document Type and Number:
WIPO Patent Application WO/2019/067923
Kind Code:
A3
Abstract:
Stripping solutions that may replace an etching resist ashing process are provided. The stripping solutions are useful for fabricating circuits and/or forming electrodes and/or packaging/bumping applications on semiconductor devices for semiconductor integrated circuits with good photoresist removal efficiency and with low silicon oxide etch rate and low metal etch rates. Methods for their use are similarly provided. The preferred stripping agents contain polar aprotic solvent, water, hydroxylamine, corrosion inhibitor, quaternary ammonium hydroxide and optional surfactant. Further provided are integrated circuit devices and electronic interconnect structures prepared according to these methods.

Inventors:
GE, Jhih, Kuei (8555 S. River Parkway, Tempe, AZ, 85284, US)
LEE, Yi-Chia (8555 S. River Parkway, Tempe, AZ, 85284, US)
LIU, Wen Dar (8555 S. River Parkway, Tempe, AZ, 85284, US)
KUO, Chi-Hsien (8555 S. River Parkway, Tempe, AZ, 85284, US)
Application Number:
US2018/053458
Publication Date:
June 06, 2019
Filing Date:
September 28, 2018
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
VERSUM MATERIALS US, LLC (8555 S. River Parkway, Tempe, AZ, 85284, US)
International Classes:
C11D11/00; C11D1/12; C11D1/38; C11D1/66; C11D1/88; C11D3/00; C11D3/30; C11D3/43
Foreign References:
US20130161840A12013-06-27
US7528098B22009-05-05
US9726978B22017-08-08
KR100913048B12009-08-25
US20100043823A12010-02-25
Attorney, Agent or Firm:
NEAGLE, Damon, A. (Design IP, P.C.5050 W. Tilghman Street, Suite 43, Allentown PA, 18104, US)
Download PDF: