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Patent Searching and Data


Title:
STROKE COMPENSATION SYSTEM AND METHOD FOR PROBE CARD
Document Type and Number:
WIPO Patent Application WO/2023/240786
Kind Code:
A1
Abstract:
A stroke compensation system and method for a probe card (2), which can be applied to a wafer test system, and the probe card (2) in the wafer test system comprises a probe head. The stroke compensation system for the probe card (2) comprises: a measuring unit, which is used to test the stroke of a single probe and flatness of all probes, and calculate a total elastic force of the probe card (2) according to values of the stroke and flatness; and a pressure sensor unit, wherein the pressure sensor unit and the probe head can be replaced with each other, so that a stroke compensation value of the probe card (2) is obtained according to a pressure and stroke relationship measured by the pressure sensor unit. According to the stroke compensation system and method for the probe card (2), the stroke of the probe of the probe card (2) can be effectively compensated during the testing of a wafer (4), and effective contact between the probe and the wafer (4) can be ensured, so that the testing yield and reliability of the wafer (4) is ensured.

Inventors:
LIANG JIAN (CN)
LUO XIONGKE (CN)
Application Number:
PCT/CN2022/113454
Publication Date:
December 21, 2023
Filing Date:
August 19, 2022
Export Citation:
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Assignee:
SHANGHAI ZENFOCUS SEMI TECH CO LTD (CN)
International Classes:
G01R31/26; G01R1/073; H01L21/66
Foreign References:
JPH11176893A1999-07-02
CN113447798A2021-09-28
CN114089160A2022-02-25
CN113484561A2021-10-08
US20160131700A12016-05-12
JPH06140479A1994-05-20
CN104049197A2014-09-17
CN112683161A2021-04-20
CN112327138A2021-02-05
JP2007165598A2007-06-28
Attorney, Agent or Firm:
BEIJING CHINACERCIS INTELLECTUAL PROPERTY CO., LTD. (CN)
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