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Patent Searching and Data


Title:
STRUCTURAL BODY, METHOD FOR MANUFACTURING STRUCTURAL BODY, AND MACHINING DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/155909
Kind Code:
A1
Abstract:
Disclosed are a structural body having better characteristics as a material of a machining device frame or the like, a method for manufacturing the structural body, and a machining device employing the structural body. A structural body (CFRP structural body) (10) has a structure in which a first material having carbon fibers as a main component, and a second material having a main component other than carbon fibers are integrated. The thermal expansion coefficient of the first material and the thermal expansion coefficient of the second material have opposite signs, and the thickness of the second material is less than the thickness of the first material. Such a structural body (10) can be used as a frame for supporting a component member of a machining device.

Inventors:
TANAKA YONETA (JP)
Application Number:
PCT/JP2019/002422
Publication Date:
August 15, 2019
Filing Date:
January 25, 2019
Export Citation:
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Assignee:
USHIO ELECTRIC INC (JP)
International Classes:
B32B5/02; B23Q1/01; B32B7/027; B32B15/08
Foreign References:
JPH11322956A1999-11-26
JPH02238930A1990-09-21
US20100223778A12010-09-09
US5593752A1997-01-14
US20150197068A12015-07-16
US20120313307A12012-12-13
US20100086729A12010-04-08
JPH10138380A1998-05-26
JP2000246566A2000-09-12
Other References:
"Curing agents for epoxy", TECHNICAL NEWS , THREEBOND HOLDINGS CO., LTD, 20 December 1990 (1990-12-20), pages 1 - 10, XP055629474, Retrieved from the Internet
"About mine-based curing agents for epoxy", JOURNAL OF THE JAPAN SOCIETY COLOUR MATERIAL, vol. 88, no. 1, 31 January 2015 (2015-01-31), pages 17 - 22, XP055629475, Retrieved from the Internet
"Curing accelerations for epoxy resins, 2013 early summer", SANYO KASEI NEWS, SANYO CHEMICAL IND LTD, no. 478, 30 August 2014 (2014-08-30), pages 1, Retrieved from the Internet
Attorney, Agent or Firm:
KONISHI, Kay et al. (JP)
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