STRUCTURAL BODY AND WIRELESS COMMUNICATION DEVICE

Title:

STRUCTURAL BODY AND WIRELESS COMMUNICATION DEVICE

Document Type and Number:

WIPO Patent Application WO/2014/148078

Kind Code:

A1

Abstract:

According to the present invention, a missing portion (4) at which an electroconductive pattern (3) is missing is present on a first resin layer (1) of a structural body (10). The first resin layer (1) and a second resin layer (2) are adhered to each other at the missing portion (4).

Inventors:

OKAJIMA YUHSUKE

Application Number:

PCT/JP2014/050830

Publication Date:

September 25, 2014

Filing Date:

January 17, 2014

Export Citation:

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Assignee:

SHARP KK (JP)

International Classes:

B32B15/08; B29C65/48; B29C65/70; H01Q1/40

Foreign References:

JP2010021687A	2010-01-28
JPH03186202A	1991-08-14
JP2011071977A	2011-04-07
JPS5867436A	1983-04-22
JP2002326305A	2002-11-12

Attorney, Agent or Firm:

HARAKENZO WORLD PATENT & TRADEMARK (JP)
Patent business corporation HARAKENZO WORLD PATENT & TRADEMARK (JP)

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